Fundamentals of Microsystems Packaging
- 17h 56m
- Rao R. Tummala
- McGraw-Hill
- 2001
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP
Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:
- Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
- Easy-to-read schematics and block diagrams
- Fundamental approaches to all system issues
- Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
- Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
- Basics of electrical and reliability testing
About the Editor
Rao R. Tummala is a Chair Professor and Director of the Microsystems Packaging Research Center at the Georgia Institute of Technology. Prior to joining Georgia Tech, he was an IBM Fellow who was involved in pioneering the industrys first multichip, LTCC and flat panel displays. He is the author of the first and best-selling microelectronics packaging reference book, Microelectronics Packaging Handbook, the definitive work in the field.
In this Book
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Introduction to Microsystems Packaging
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The Role of Packaging in Microelectronics
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The Role of Packaging in Microsystems
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Fundamentals of Electrical Package Design
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Fundamentals of Design for Reliability
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Fundamentals of Thermal Management
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Fundamentals of Single Chip Packaging
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Fundamentals of Multichip Packaging
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Fundamentals of IC Assembly
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Fundamentals of Wafer-Level Packaging
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Fundamentals of Passives: Discrete, Integrated, and Embedded
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Fundamentals of Optoelectronics
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Fundamentals of RF Packaging
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Fundamentals of Microelectromechanical Systems
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Fundamentals of Sealing and Encapsulation
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Fundamentals of System-Level PWB Technologies
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Fundamentals of Board Assembly
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Fundamentals of Packaging Materials and Processes
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Fundamentals of Electrical Testing
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Fundamentals of Package Manufacturing
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Fundamentals of Microsystems Design for Environment
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Fundamentals of Microsystems Reliability
