Printed Circuits Handbook, Fifth Edition

  • 27h 3m
  • Clyde F. Coombs, Jr (ed)
  • McGraw-Hill
  • 2001

Resolve all your workday questions with the PCB answer book.

Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, Coombs' PRINTED CIRCUITS HANDBOOK, Fifth Edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. This new edition of the most trusted guide to pcbs gives you:

  • Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, microvia fabrication, sequential lamination, assembly, testing, and reliability
  • Coverage of fabrication developments including: blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating
  • Thorough examination of base materials, including traditional and alternative laminates
  • Understanding of effective quality and reliability programs, including: test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control
  • Full treatment of multi-layer and flexible printed circuit design, fabrication and assembly advanced single- and multi-chip component packaging
  • Contributions from pros at Motorola, Cisco, and other major companies
  • Hundreds of illustrations and instant-access tables, and formulas

In this Book

  • ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
  • SEMICONDUCTOR PACKAGING TECHNOLOGY
  • ADVANCED PACKAGING
  • TYPES OF PRINTED WIRING BOARDS
  • INTRODUCTION TO BASE MATERIALS
  • BASE MATERIAL COMPONENTS
  • BASE MATERIAL MANUFACTURING PROCESSES
  • PROPERTIES OF BASE MATERIALS
  • DENSIFICATION ISSUES FOR BASE MATERIALS
  • INTRODUCING BASE MATERIALS INTO THE PCB MANUFACTURING PROCESS
  • HDI MICROVIA MATERIALS
  • LAMINATE QUALIFICATION AND TESTING
  • PHYSICAL CHARACTERISTICS OF THE PCB
  • THE PCB DESIGN PROCESS
  • ELECTRICAL AND MECHANICAL DESIGN PARAMETERS
  • CONTROLLED IMPEDANCE
  • MULTILAYER DESIGN ISSUES
  • PLANNING FOR DESIGN, FABRICATION, AND ASSEMBLY
  • MANUFACTURING INFORMATION DOCUMENTATION AND TRANSFER
  • ELECTRONIC CONTRACT MANUFACTURING SUPPLIER SELECTION AND MANAGEMENT
  • INTRODUCTION TO HIGH-DENSITY INTERCONNECTION TECHNOLOGY
  • HIGH-DENSITY INTERCONNECT–BUILD-UP TECHNOLOGIES
  • MICROVIA HOLE TECHNOLOGIES
  • DRILLING PROCESSES
  • HIGH-DENSITY INTERCONNECT DRILLING
  • IMAGING
  • MULTILAYER MATERIALS AND PROCESSING
  • PREPARING BOARDS FOR PLATING
  • ELECTROPLATING
  • DIRECT PLATING
  • PWB MANUFACTURE USING FULLY ELECTROLESS COPPER
  • SURFACE FINISHES
  • ETCHING PROCESS AND TECHNOLOGIES
  • SOLDER RESIST MATERIAL AND PROCESSES
  • MACHINING AND ROUTING
  • PROCESS CAPABILITY AND CONTROL
  • BARE BOARD TEST OBJECTIVES AND DEFINITIONS
  • BARE BOARD TEST METHODS
  • BARE BOARD TEST EQUIPMENT
  • HDI BARE BOARD SPECIAL TESTING METHODS
  • ASSEMBLY PROCESSES
  • DESIGN FOR SOLDERING AND SOLDERABILITY
  • SOLDER MATERIALS AND PROCESSES
  • NO-CLEAN ASSEMBLY PROCESS
  • LEAD-FREE SOLDERING
  • FLUXES AND CLEANING
  • PRESS-FIT CONNECTIONS
  • ACCEPTABILITY OF FABRICATED BOARDS
  • ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
  • ASSEMBLY INSPECTION
  • DESIGN FOR TESTING
  • LOADED BOARD TESTING
  • RELIABILITY OF PRINTED CIRCUIT ASSEMBLIES
  • COMPONENT-TO-PWB RELIABILITY
  • PROCESS WASTE MINIMIZATION AND TREATMENT
  • FLEXIBLE CIRCUITS: APPLICATIONS AND MATERIALS
  • DESIGN OF FLEXIBLE CIRCUITS
  • MANUFACTURING OF FLEXIBLE CIRCUITS
  • TERMINATION OF FLEXIBLE CIRCUITS
  • SPECIAL CONSTRUCTIONS OF FLEXIBLE CIRCUITS
  • QUALITY ASSURANCE OF FLEXIBLE CIRCUITS
  • Backmatter
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